Effects of Zn, Ni, Bi, In and Co on the Electrical Resistivity of Sn–Ag–Cu Solder
Copy For Citation
BÜYÜK U., ENGİN S.
2. Uluslararası Malzeme Bilimi ve Teknolojisi Konferansı (IMSTEC’17), Nevşehir, Turkey, 11 - 13 October 2017, pp.81, (Summary Text)
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Publication Type:
Conference Paper / Summary Text
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City:
Nevşehir
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Country:
Turkey
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Page Numbers:
pp.81
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Erciyes University Affiliated:
Yes