Effects of Zn, Ni, Bi, In and Co on the Electrical Resistivity of Sn–Ag–Cu Solder


BÜYÜK U., ENGİN S.

2. Uluslararası Malzeme Bilimi ve Teknolojisi Konferansı (IMSTEC’17), Nevşehir, Turkey, 11 - 13 October 2017, pp.81

  • Publication Type: Conference Paper / Summary Text
  • City: Nevşehir
  • Country: Turkey
  • Page Numbers: pp.81
  • Erciyes University Affiliated: Yes