Effect of composition on microhardness electrical and thermal properties in the Sn Cu alloys


ÇADIRLI E., KAYA H.

3rd International Conference on Advances in Solidification Processes (ICASP 3), Aachen/Rolduc, Germany, 7 - 10 June 2011

  • Publication Type: Conference Paper
  • City: Aachen/Rolduc
  • Country: Germany