ÇADIRLI, E. And KAYA, H. 2011. Effect of composition on microhardness electrical and thermal properties in the Sn Cu alloys. 3rd International Conference on Advances in Solidification Processes (ICASP 3) , (Aachen/Rolduc, Germany).

ÇADIRLI, E., & KAYA, H., (2011). Effect of composition on microhardness electrical and thermal properties in the Sn Cu alloys . 3rd International Conference on Advances in Solidification Processes (ICASP 3), Aachen/Rolduc, Germany

ÇADIRLI, EMİN, And HASAN KAYA. "Effect of composition on microhardness electrical and thermal properties in the Sn Cu alloys," 3rd International Conference on Advances in Solidification Processes (ICASP 3), Aachen/Rolduc, Germany, 2011

ÇADIRLI, EMİN And KAYA, HASAN. "Effect of composition on microhardness electrical and thermal properties in the Sn Cu alloys." 3rd International Conference on Advances in Solidification Processes (ICASP 3) , Aachen/Rolduc, Germany, 2011

ÇADIRLI, E. And KAYA, H. (2011) . "Effect of composition on microhardness electrical and thermal properties in the Sn Cu alloys." 3rd International Conference on Advances in Solidification Processes (ICASP 3) , Aachen/Rolduc, Germany.

@conferencepaper{conferencepaper, author={EMİN ÇADIRLI And author={HASAN KAYA}, title={Effect of composition on microhardness electrical and thermal properties in the Sn Cu alloys}, congress name={3rd International Conference on Advances in Solidification Processes (ICASP 3)}, city={Aachen/Rolduc}, country={Germany}, year={2011}}