Investigation of Thermal Residual Stresses in an Adhesively Bonded Functionally Graded Single Lap Joint


APALAK M. K., GÜNEŞ R.

The Sixth International Congress on Thermal Stresses THERMAL STRESSES 2005, TS-2005, Vienna, Austria, Austria, 1 - 04 May 2005, pp.1

  • Publication Type: Conference Paper / Full Text
  • Country: Austria
  • Page Numbers: pp.1
  • Erciyes University Affiliated: Yes