APALAK, M. K. And GÜNEŞ, R. 2005. Investigation of Thermal Residual Stresses in an Adhesively Bonded Functionally Graded Single Lap Joint. The Sixth International Congress on Thermal Stresses THERMAL STRESSES 2005, TS-2005, Vienna, Austria , (Austria), 1.

APALAK, M. K., & GÜNEŞ, R., (2005). Investigation of Thermal Residual Stresses in an Adhesively Bonded Functionally Graded Single Lap Joint . The Sixth International Congress on Thermal Stresses THERMAL STRESSES 2005, TS-2005, Vienna, Austria (pp.1). , Austria

APALAK, MUSTAFA, And RECEP GÜNEŞ. "Investigation of Thermal Residual Stresses in an Adhesively Bonded Functionally Graded Single Lap Joint," The Sixth International Congress on Thermal Stresses THERMAL STRESSES 2005, TS-2005, Vienna, Austria, Austria, 2005

APALAK, MUSTAFA K. And GÜNEŞ, RECEP. "Investigation of Thermal Residual Stresses in an Adhesively Bonded Functionally Graded Single Lap Joint." The Sixth International Congress on Thermal Stresses THERMAL STRESSES 2005, TS-2005, Vienna, Austria , Austria, pp.1, 2005

APALAK, M. K. And GÜNEŞ, R. (2005) . "Investigation of Thermal Residual Stresses in an Adhesively Bonded Functionally Graded Single Lap Joint." The Sixth International Congress on Thermal Stresses THERMAL STRESSES 2005, TS-2005, Vienna, Austria , Austria, p.1.

@conferencepaper{conferencepaper, author={MUSTAFA KEMAL APALAK And author={RECEP GÜNEŞ}, title={Investigation of Thermal Residual Stresses in an Adhesively Bonded Functionally Graded Single Lap Joint}, congress name={The Sixth International Congress on Thermal Stresses THERMAL STRESSES 2005, TS-2005, Vienna, Austria}, city={}, country={Austria}, year={2005}, pages={1} }