Determination of solid-liquid interfacial energies in the In-Bi-Sn ternary alloy


Akbulut S., Ocak Y. , Maraşlı N. , Keslioglu K., Kaya H. , Çadırlı E.

JOURNAL OF PHYSICS D-APPLIED PHYSICS, vol.41, no.17, 2008 (Journal Indexed in SCI) identifier identifier

  • Publication Type: Article / Article
  • Volume: 41 Issue: 17
  • Publication Date: 2008
  • Doi Number: 10.1088/0022-3727/41/17/175302
  • Title of Journal : JOURNAL OF PHYSICS D-APPLIED PHYSICS

Abstract

The equilibrated grain boundary groove shapes of solid In(2)Bi solution in equilibrium with the In-Bi-Sn eutectic liquid were observed from a quenched sample at 59 degrees C. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of the solid In2Bi solution have been determined to be (1.42 +/- 0.07) x 10(-7) Km, (49.6 +/- 5.0) x 10(-3) Jm(-2) and (97.1 +/- 10.7) x 10(-3) Jm(-2), respectively, from the observed grain boundary groove shapes. The thermal conductivities of the solid phases for In-21.23 at% Bi-19.04 at% Sn and In-30.5 at% Bi-3 at% Sn alloys and the thermal conductivity ratio of the liquid phase to the solid phase for In-21.23 at% Bi-19.04 at% Sn have also been measured with a radial heat flow apparatus and a Bridgman type growth apparatus, respectively, at their melting temperature.