Influence of growth rate on microstructure, microhardness, and electrical resistivity of directionally solidified Al-7 wt% Ni hypo-eutectic alloy
METALS AND MATERIALS INTERNATIONAL, cilt.19, sa.1, ss.39-44, 2013 (SCI-Expanded, Scopus)
- Yayın Türü: Makale / Tam Makale
- Cilt numarası: 19 Sayı: 1
- Basım Tarihi: 2013
- Doi Numarası: 10.1007/s12540-013-1007-4
- Dergi Adı: METALS AND MATERIALS INTERNATIONAL
- Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
- Sayfa Sayıları: ss.39-44
- Erciyes Üniversitesi Adresli: Evet
Özet
Al-7 wt% Ni alloy was directionally solidified upwards with different growth rates, V (8.3-489.5 µm/s) at constanttemperature gradient, G (4.2 K/mm) using a Bridgman-type growth apparatus. The dependence of thedendritic microstructures such as primary dendrite arm spacing (λ1) and secondary dendrite arm spacing(λ2) on the growth rate were determined using a linear regression analysis. The present experimental resultswere also compared with similar previous experimental results. Measurements of microhardness (HV) and electrical resistivity (ρ) of the directionally solidified samples were carried out. The dependence of the microhardness and electrical resistivity on the growth rate (V) was also analyzed. According to these results, it has been found that, for increasing values of V, the values of HV and ρ increase. However, the values of HV and ρ decrease with increasing values of λ1 and λ2.