Variations of Microhardness with Solidification Parameters and Electrical Resistivity with Temperature for Al Cu Ag Eutectic Alloy


BÜYÜK U., MARAŞLI N., ÇADIRLI E., KAYA H., KEŞLİOĞLU K.

Current Applied Physics, vol.12, pp.7-10, 2012 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 12
  • Publication Date: 2012
  • Doi Number: 10.1016/j.cap.2011.04.018
  • Journal Name: Current Applied Physics
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Page Numbers: pp.7-10
  • Keywords: Ternary alloy, Eutectic, Microhardness, Electrical resistivity, Enthalpy, LOW-MELTING POINT, SN TERNARY ALLOY, MICROINDENTATION HARDNESS, MICROSTRUCTURE PARAMETERS, DEPENDENCY, SPACINGS, GRADIENT, KINETICS, SYSTEM
  • Erciyes University Affiliated: Yes