Investigation of the Effect of Solidification Processing Parameters on the Rod Spacings and Variation of Microhardness with the Rod Spacing in the Sn Cu Hypereutectic Alloy

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ÇADIRLI E., BÜYÜK U., ENGİN S., KAYA H., MARAŞLI N., KEŞLİOĞLU K., ...More

Journal Of Materials Science-Materials In Electronics, vol.21, pp.608-618, 2010 (SCI-Expanded)

• Publication Type: Article / Article
• Volume: 21
• Publication Date: 2010
• Doi Number: 10.1007/s10854-009-9965-5
• Journal Name: Journal Of Materials Science-Materials In Electronics
• Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
• Page Numbers: pp.608-618
• Erciyes University Affiliated: Yes