Investigation of the Effect of Solidification Processing Parameters on the Rod Spacings and Variation of Microhardness with the Rod Spacing in the Sn Cu Hypereutectic Alloy


ÇADIRLI E., BÜYÜK U., ENGİN S., KAYA H., MARAŞLI N., KEŞLİOĞLU K., ...More

Journal Of Materials Science-Materials In Electronics, vol.21, pp.608-618, 2010 (SCI-Expanded) identifier identifier