Copper(II) Hybrid Nanoflower-Supported Carbon Nanotubes on Copper Foil for Dye-Sensitized Solar Cells


Dayan S., Özdemir N., Akbulut M., Özpozan N.

JOURNAL OF ELECTRONIC MATERIALS, cilt.51, sa.10, ss.5965-5975, 2022 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 51 Sayı: 10
  • Basım Tarihi: 2022
  • Doi Numarası: 10.1007/s11664-022-09781-7
  • Dergi Adı: JOURNAL OF ELECTRONIC MATERIALS
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus, PASCAL, Applied Science & Technology Source, Chemical Abstracts Core, Chimica, Compendex, Computer & Applied Sciences, INSPEC
  • Sayfa Sayıları: ss.5965-5975
  • Anahtar Kelimeler: Hybrid nanoflowers, copper foil, DSSC, counter electrode, COUNTER ELECTRODE, PERFORMANCE IMPROVEMENT, CATALYTIC-ACTIVITY, EFFICIENCY, FABRICATION, NANOMATERIALS, COMPLEXES, SURFACE
  • Erciyes Üniversitesi Adresli: Evet

Özet

Here, modified flower-like hybrid nanomaterials (Nfs) on copper foil (CFS) were successfully fabricated and tested as counter electrodes (Pt-free) in dye-sensitized solar cells (DSSCs). The copper foil was activated and modified with phosphate ions to form a flower-like hybrid nanomaterial on the copper foil surface [Cu(II)Nfs@CFS], and multi-walled carbon nanotubes (MWCNTs) were then immobilized on the structure [Cu(II)Nfs/MWCNTs@CFS] in order to strengthen the photovoltaic parameters. As expected, a significant difference in performance was observed between the materials. The power conversion efficiency (PCE), open-circuit voltage (V-oc) short-circuit current (J(sc)), and fill factor (FF) recorded for the fabricated electrodes were 0.19%, 0.354 V, 2.386 mA/cm(2), and 0.23 for Cu(II)Nfs@CFS, and 1.08%, 0.639 V, 3.909 mA/cm(2), and 0.43 for Cu(II)Nfs/MWCNTs@CFS, respectively. It is notable that the PCE values increased by fivefold, and the immobilization process contributed to the improved V-oc, J(sc), and FF values. With different modifications of such materials, it will be possible to design DSSC devices with higher performance in the future.