Thermal stresses in adhesively bonded joints/patches and their modeling: A critical review


Kemal Apalak M. K.

Reviews of Adhesion and Adhesives, vol.4, no.3, pp.223-280, 2016 (Journal Indexed in ESCI) identifier identifier

  • Publication Type: Article / Article
  • Volume: 4 Issue: 3
  • Publication Date: 2016
  • Doi Number: 10.7569/raa.2016.097310
  • Title of Journal : Reviews of Adhesion and Adhesives
  • Page Numbers: pp.223-280