Thermal stresses in adhesively bonded joints/patches and their modeling: A critical review

Kemal Apalak M. K.

Reviews of Adhesion and Adhesives, vol.4, no.3, pp.223-280, 2016 (ESCI, Scopus) identifier identifier

  • Publication Type: Article / Article
  • Volume: 4 Issue: 3
  • Publication Date: 2016
  • Doi Number: 10.7569/raa.2016.097310
  • Journal Name: Reviews of Adhesion and Adhesives
  • Journal Indexes: Emerging Sources Citation Index (ESCI), Scopus
  • Page Numbers: pp.223-280
  • Erciyes University Affiliated: Yes