Determination of thermal conductivities of Sn-Zn lead-free solder alloys with radial heat flow and Bridgman-type apparatus

Meydaneri F., SAATÇİ B., GÜNDÜZ M., Ozdemir M.

CONTINUUM MECHANICS AND THERMODYNAMICS, vol.25, no.6, pp.691-704, 2013 (SCI-Expanded) identifier identifier

  • Publication Type: Article / Article
  • Volume: 25 Issue: 6
  • Publication Date: 2013
  • Doi Number: 10.1007/s00161-012-0263-8
  • Journal Name: CONTINUUM MECHANICS AND THERMODYNAMICS
  • Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Page Numbers: pp.691-704
  • Keywords: Non-ferrous metals and alloys, Casting, Thermal conductivity, Radial heat flow, LIQUID INTERFACIAL ENERGY, VIBRATION FRACTURE, SURFACE ENERGIES, SOLID ZN, PB-SN, AL, PHASES, CD, CU
  • Erciyes University Affiliated: Yes

Abstract

The variations of thermal conductivities of solid phases versus temperature for pure Sn, pure Zn and Sn-9 wt.% Zn, Sn-14 wt.% Zn, Sn-50 wt.% Zn, Sn-80 wt.% Zn binary alloys were measured with a radial heat flow apparatus. The thermal conductivity ratios of liquid phase to solid phase for the pure Sn, pure Zn and eutectic Sn-9 wt.% Zn alloy at their melting temperature are found with a Bridgman-type directional solidification apparatus. Thus, the thermal conductivities of liquid phases for pure Sn, pure Zn and eutectic Sn-9 wt.% Zn binary alloy at their melting temperature were evaluated by using the values of solid phase thermal conductivities and the thermal conductivity ratios of liquid phase to solid phase.