The equilibrated grain boundary groove shapes of solid Sn solution in equilibrium with Sn-Bi-Ag liquid were observed from a quenched sample by using a radial heat flow apparatus. The Gibbs Thomson coefficient, solid liquid interfacial energy, and grain boundary energy of the solid Sn solution were determined from the observed grain boundary groove shapes. The thermal conductivity of the solid phase for Sn-10 at.%Bi-2 at.%Ag alloy and the thermal conductivity ratio of the liquid phase to the solid phase for Sn-10 at.%Bi-2 at.%Ag alloy at the melting temperature were also measured with a radial heat flow apparatus and a Bridgman-type growth apparatus, respectively. A comparison of present results for solid Sn solution in the Sn-10 at.%Bi-2 at.%Ag alloy with the results obtained in previous works for similar solid Sn in equilibrium with different binary or ternary liquid was made. From the comparison, it can be concluded that for solid Sn solution in equilibrium with different liquid, the Gibbs-Thomson coefficient seems to be constant and does not depend on the composition of liquid but solid-liquid interfacial energy changes little bit with composition of liquid at a constant temperature. (C) 2013 Elsevier B.V. All rights reserved.