Influence of the growth rate on eutectic microstructures and Physical Properties of Aluminum–Silicon–Nickel Alloy

Aker A., KAYA H.

International Science Conference, Amsterdam, Netherlands, 15 April - 16 May 2014, pp.514

  • Publication Type: Conference Paper / Full Text
  • City: Amsterdam
  • Country: Netherlands
  • Page Numbers: pp.514
  • Erciyes University Affiliated: Yes

Abstract

Al-12.6wt.%Si-%2wt.Ni alloy was prepared in a graphite crucible under vacuum atmosphere. 
The samples were directionally solidified upwards with different growth rate at constant 
temperature gradient using by Bridgman–type growth apparatus. The values of 
microstructures was measured from transverse sections of the samples. The microhardness 
(HV), ultimate tensile strength and electrical resistivity of the directional solidification 
samples were also measured. Influence of the growth rate and spacings on microhardness, 
ultimate tensile strength and electrical resistivity were investigated and the relationships 
between them were experimentally obtained by using regression analysis. The results 
obtained in present work were compared with the previous similar experimental results 
obtained for binary and ternary alloys.