Akademik Veri Yönetim Sistemi
JOURNAL OF ELECTRONIC MATERIALS, cilt.46, sa.7, ss.3987-3994, 2017 (SCI-Expanded)
This study aims to investigate tensile/shear behavior of multi-stitched/nano composites. For this purpose, non-stitched, non-stitched/nano, multi-stitched and multi-stitched/nano composites were made. It was shown that the warp/filling tensile strength and modulus of composites were slightly reduced in both multi-stitched and multi-stitched/nano composites due to fiber breakage that resulted from the multi-stitching process. In addition, there were not significant differences between non-stitched and multi-stitched structures. The non-stitched/nano composite showed slightly higher in-plane shear strength compared with the non-stitched composite. The in-plane shear strength of the non-stitched composite, on the other hand, increased steadily compared to the multi-stitched composite because of the stitching process and the interface between the stitching yarn and polymer matrix. Stitching significantly improved the delamination resistance in the multi-stitched and multi-stitched/nano composites experienced a small amount of damaged areas. The incorporation of nano silica improved the damage resistance of multi-stitched composites. Therefore, the damaged tolerance composite was developed with stitching and the addition of the nano silica for various industrial applications, such as electronic boards.