Tensile/Shear Behaviour of Multi-stitched/Nano Composites


Bilisik K. , Kaya G.

JOURNAL OF ELECTRONIC MATERIALS, cilt.46, ss.3987-3994, 2017 (SCI İndekslerine Giren Dergi) identifier identifier

  • Cilt numarası: 46 Konu: 7
  • Basım Tarihi: 2017
  • Doi Numarası: 10.1007/s11664-017-5365-4
  • Dergi Adı: JOURNAL OF ELECTRONIC MATERIALS
  • Sayfa Sayıları: ss.3987-3994

Özet

This study aims to investigate tensile/shear behavior of multi-stitched/nano composites. For this purpose, non-stitched, non-stitched/nano, multi-stitched and multi-stitched/nano composites were made. It was shown that the warp/filling tensile strength and modulus of composites were slightly reduced in both multi-stitched and multi-stitched/nano composites due to fiber breakage that resulted from the multi-stitching process. In addition, there were not significant differences between non-stitched and multi-stitched structures. The non-stitched/nano composite showed slightly higher in-plane shear strength compared with the non-stitched composite. The in-plane shear strength of the non-stitched composite, on the other hand, increased steadily compared to the multi-stitched composite because of the stitching process and the interface between the stitching yarn and polymer matrix. Stitching significantly improved the delamination resistance in the multi-stitched and multi-stitched/nano composites experienced a small amount of damaged areas. The incorporation of nano silica improved the damage resistance of multi-stitched composites. Therefore, the damaged tolerance composite was developed with stitching and the addition of the nano silica for various industrial applications, such as electronic boards.