Effect of Minor Sb Additions on Thermal Properties, Microstructure and Microhardness of Sn-Ag-Cu High-Temperature Solder Alloys
PHYSICS OF METALS AND METALLOGRAPHY, vol.124, no.13, pp.1547-1554, 2023 (SCI-Expanded, Scopus)
- Publication Type: Article / Article
- Volume: 124 Issue: 13
- Publication Date: 2023
- Doi Number: 10.1134/s0031918x22601974
- Journal Name: PHYSICS OF METALS AND METALLOGRAPHY
- Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Aerospace Database, Compendex, INSPEC, Metadex
- Page Numbers: pp.1547-1554
- Keywords: microhardness, microstructure, SAC105 solder alloys, thermal conductivity, electrical conductivity
- Erciyes University Affiliated: Yes
Abstract
In the present study, changes in thermal properties, microstructure and microhardness were investigated when 0.5, 1, 1.5 wt % Sb were added to Sn-1 wt % Ag-0.5 wt % Cu (SAC105) solder alloy system. The addition of Sb caused a significant improvement in microhardness while decreasing the melting temperature range, thermal conductivity and electrical conductivity. Addition of 0.5, 1, 1.5 wt % Sb to SAC105 alloy system decreased the thermal conductivity by 48% and electrical conductivity by 27%. The addition of Sb at the same rate increased the microhardness by 27%.