Effect of Minor Sb Additions on Thermal Properties, Microstructure and Microhardness of Sn-Ag-Cu High-Temperature Solder Alloys

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AKSÖZ S., Ocal F., Esener P. A., ÖZTÜRK E., MARAŞLI N.

PHYSICS OF METALS AND METALLOGRAPHY, vol.124, no.13, pp.1547-1554, 2023 (SCI-Expanded)

• Publication Type: Article / Article
• Volume: 124 Issue: 13
• Publication Date: 2023
• Doi Number: 10.1134/s0031918x22601974
• Journal Name: PHYSICS OF METALS AND METALLOGRAPHY
• Journal Indexes: Science Citation Index Expanded (SCI-EXPANDED), Scopus, Aerospace Database, Compendex, INSPEC, Metadex
• Page Numbers: pp.1547-1554
• Keywords: microhardness, microstructure, SAC105 solder alloys, thermal conductivity, electrical conductivity
• Erciyes University Affiliated: Yes

Abstract

In the present study, changes in thermal properties, microstructure and microhardness were investigated when 0.5, 1, 1.5 wt % Sb were added to Sn-1 wt % Ag-0.5 wt % Cu (SAC105) solder alloy system. The addition of Sb caused a significant improvement in microhardness while decreasing the melting temperature range, thermal conductivity and electrical conductivity. Addition of 0.5, 1, 1.5 wt % Sb to SAC105 alloy system decreased the thermal conductivity by 48% and electrical conductivity by 27%. The addition of Sb at the same rate increased the microhardness by 27%.