The Microstructure Parameters and Microhardness of Directionally Solidified Sn Ag Cu Eutectic Alloy

BÜYÜK U., MARAŞLI N.

Journal Of Alloys And Compounds, cilt.485, ss.264-269, 2009 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 485
  • Basım Tarihi: 2009
  • Doi Numarası: 10.1016/j.jallcom.2009.06.067
  • Dergi Adı: Journal Of Alloys And Compounds
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Sayfa Sayıları: ss.264-269
  • Anahtar Kelimeler: Directional solidification, Eutectics, Growth from melt, Ternary alloys, MECHANICAL-PROPERTIES, GROWTH-RATE, TEMPERATURE-GRADIENT, CREEP-BEHAVIOR, SOLDER, HARDNESS, LAMELLAR, SYSTEM, RATES, TIN
  • Erciyes Üniversitesi Adresli: Evet