Thermal conductivity and interfacial energies of solid Sn solution in the Sn-Ag-In ternary alloy

Ocak Y. , Aksoz S., Marasli N. , Keslioglu K.

CHEMICAL PHYSICS LETTERS, vol.496, pp.263-269, 2010 (Journal Indexed in SCI) identifier identifier

  • Publication Type: Article / Article
  • Volume: 496
  • Publication Date: 2010
  • Doi Number: 10.1016/j.cplett.2010.07.049
  • Page Numbers: pp.263-269


The equilibrated grain boundary groove shapes of solid Sn solution in equilibrium with the Sn-Ag-In liquid have been observed from quenched sample. The Gibbs-Thomson coefficient, solid-liquid interfacial energy and grain boundary energy of solid Sn solution have been determined. The thermal conductivity values for solid Sn solution (Sn-2.1 at.%In) and eutectic solid (Sn-4.4 at.%Ag-2.1 at.%In) and the thermal conductivity ratio of eutectic liquid phase to eutectic solid for Sn-4.4 at.%Ag-2.1 at.%In alloy at the melting temperature have also been measured with a radial heat flow apparatus and Bridgman type growth apparatus, respectively. (C) 2010 Elsevier B.V. All rights reserved.