Effects of Cooling Rate and Composition on Mechanical Properties of Directionally Solidified Pb100-x-Sn-x Solders


ÇADIRLI E. , KAYA H. , ŞAHİN M.

JOURNAL OF ELECTRONIC MATERIALS, cilt.40, sa.9, ss.1903-1911, 2011 (SCI İndekslerine Giren Dergi) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 40 Konu: 9
  • Basım Tarihi: 2011
  • Doi Numarası: 10.1007/s11664-011-1668-z
  • Dergi Adı: JOURNAL OF ELECTRONIC MATERIALS
  • Sayfa Sayıları: ss.1903-1911

Özet

Pb100-x-Sn-x solders (x = 5 wt.%, 10 wt.%, 20 wt.%, 35 wt.%, 50 wt.%, 60 wt.%, 61.9 wt.%, and 95 wt.%) were directionally solidified upward over a wide range of cooling rates (T) over dot (0.016 K s(-1) to 4.0 K s(-1)) by using a Bridgman-type directional solidification furnace. Microstructure parameters (primary dendrite arm spacing, lambda(1), and eutectic spacing, lambda(E)) and mechanical properties (microhardness, HV, and ultimate tensile strength, sigma) of the Pb100-x-Sn-x alloys were measured. The dependences of the microhardness and ultimate tensile strength on the cooling rate, microstructure parameters, and composition were determined. According to experimental results, the microhardness and ultimate tensile strength of the solidified samples increase with increasing cooling rate and Sn content, but decrease with increasing microstructure parameters.
Pb100x-Snx solders (x = 5 wt.%, 10 wt.%, 20 wt.%, 35 wt.%, 50 wt.%, 60 wt.%, 61.9 wt.%, and 95 wt.%) were directionally solidified upward over a wide range of cooling rates _T (0.016 K s1 to 4.0 K s1) by using a Bridgman-type directional solidification furnace. Microstructure parameters (primary dendrite arm spacing, k1, and eutectic spacing, kE) and mechanical properties (microhardness, HV, and ultimate tensile strength, r) of the Pb100x-Snx alloys were measured. The dependences of the microhardness and ultimate tensile strength on the cooling rate, microstructure parameters, and composition were determined. According to experimental results, the microhardness and ultimate tensile strength of the solidified samples increase with increasing cooling rate and Sn content, but decrease with increasing microstructure parameters.