Investigation of the Some Physical Properties of the Directionally Solidified Al-Cu-Co Ternary Eutectic Alloy

Cadirli E., Yilmazer I., Sahin M., KAYA H.

TRANSACTIONS OF THE INDIAN INSTITUTE OF METALS, cilt.68, sa.5, ss.817-827, 2015 (SCI-Expanded) identifier identifier

  • Yayın Türü: Makale / Tam Makale
  • Cilt numarası: 68 Sayı: 5
  • Basım Tarihi: 2015
  • Doi Numarası: 10.1007/s12666-015-0515-y
  • Dergi Adı: TRANSACTIONS OF THE INDIAN INSTITUTE OF METALS
  • Derginin Tarandığı İndeksler: Science Citation Index Expanded (SCI-EXPANDED), Scopus
  • Sayfa Sayıları: ss.817-827
  • Anahtar Kelimeler: Directional solidification, Ternary eutectic alloy, Microhardness, Compressive strength, Electrical resistivity, Thermal conductivity, MECHANICAL-PROPERTIES, MICROSTRUCTURE PARAMETERS, LAMELLAR STRUCTURE, ELECTRICAL-RESISTIVITY, PROCESSING PARAMETERS, GROWTH-RATE, MICROHARDNESS, TEMPERATURE, ALUMINUM, DEPENDENCY
  • Erciyes Üniversitesi Adresli: Evet

Özet

The Al-23.9% Cu-1.2% Co (wt%) ternary eutectic alloy was prepared using a vacuum melting furnace and a casting furnace. The samples were directionally solidified upwards at a constant growth velocity (18.8 mu m/s) under different temperature gradients (1.23-5.66 K/mm) and at a constant temperature gradient (5.66 K/mm) under different growth velocities (8.3-166 mu m/s) in a Bridgman-type directional solidification furnace. The dependence of the eutectic spacing on the solidification parameters (temperature gradient and growth rate) and that of the microhardness and compressive strength on the eutectic spacing and solidification parameters were investigated. The electrical resistivity measurements of the studied alloy were performed and the temperature coefficient of the resistivity was calculated from the curve of the resulting rho-Icurrency sign plot. The thermal conductivities of the sample grown at a constant temperature gradient and growth rate were obtained using the Wiedemann-Franz and Smith-Palmer equations.

The Al–23.9% Cu–1.2% Co (wt%) ternary eutectic alloy was prepared using a vacuum melting furnace and a casting furnace. The samples were directionally solidified upwards at a constant growth velocity (18.8 lm/s) under different temperature gradients (1.23–5.66 K/mm) and at a constant temperature gradient (5.66 K/mm) under different growth velocities (8.3–166 lm/s) in a Bridgmantype directional solidification furnace. The dependence of the eutectic spacing on the solidification parameters (temperature
gradient and growth rate) and that of the microhardness and compressive strength on the eutectic spacing and solidification parameters were investigated. The electrical
resistivity measurements of the studied alloy were performed and the temperature coefficient of the resistivity was calculated from the curve of the resulting q–S plot. The
thermal conductivities of the sample grown at a constant temperature gradient and growth rate were obtained using the Wiedemann–Franz and Smith–Palmer equations.