APALAK, M. K. And Bagci, M. D. 2011. Thermal Residual Stresses in Adhesively Bonded In-plane Functionally Graded Clamped Plates Subjected to an Edge Heat Flux. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY , vol.25, no.15 , 1861-1908.

APALAK, M. K., & Bagci, M. D., (2011). Thermal Residual Stresses in Adhesively Bonded In-plane Functionally Graded Clamped Plates Subjected to an Edge Heat Flux. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY , vol.25, no.15, 1861-1908.

APALAK, MUSTAFA, And MUNİSE DİDEM DEMİRBAŞ. "Thermal Residual Stresses in Adhesively Bonded In-plane Functionally Graded Clamped Plates Subjected to an Edge Heat Flux," JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY , vol.25, no.15, 1861-1908, 2011

APALAK, MUSTAFA K. And Bagci, MUNİSE D. . "Thermal Residual Stresses in Adhesively Bonded In-plane Functionally Graded Clamped Plates Subjected to an Edge Heat Flux." JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY , vol.25, no.15, pp.1861-1908, 2011

APALAK, M. K. And Bagci, M. D. (2011) . "Thermal Residual Stresses in Adhesively Bonded In-plane Functionally Graded Clamped Plates Subjected to an Edge Heat Flux." JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY , vol.25, no.15, pp.1861-1908.

@article{article, author={MUSTAFA KEMAL APALAK And author={MUNİSE DİDEM DEMİRBAŞ}, title={Thermal Residual Stresses in Adhesively Bonded In-plane Functionally Graded Clamped Plates Subjected to an Edge Heat Flux}, journal={JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY}, year=2011, pages={1861-1908} }