APALAK, M. K. And DEMİRBAŞ, M. D. 2013. Thermal residual stresses in adhesively bonded in-plane functionally graded clamped circular hollow plates. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY , vol.27, no.14 , 1590-1623.

APALAK, M. K., & DEMİRBAŞ, M. D., (2013). Thermal residual stresses in adhesively bonded in-plane functionally graded clamped circular hollow plates. JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY , vol.27, no.14, 1590-1623.

APALAK, MUSTAFA, And MUNİSE DİDEM DEMİRBAŞ. "Thermal residual stresses in adhesively bonded in-plane functionally graded clamped circular hollow plates," JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY , vol.27, no.14, 1590-1623, 2013

APALAK, MUSTAFA K. And DEMİRBAŞ, MUNİSE D. . "Thermal residual stresses in adhesively bonded in-plane functionally graded clamped circular hollow plates." JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY , vol.27, no.14, pp.1590-1623, 2013

APALAK, M. K. And DEMİRBAŞ, M. D. (2013) . "Thermal residual stresses in adhesively bonded in-plane functionally graded clamped circular hollow plates." JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY , vol.27, no.14, pp.1590-1623.

@article{article, author={MUSTAFA KEMAL APALAK And author={MUNİSE DİDEM DEMİRBAŞ}, title={Thermal residual stresses in adhesively bonded in-plane functionally graded clamped circular hollow plates}, journal={JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY}, year=2013, pages={1590-1623} }