U. BÖYÜK And N. MARAŞLI, "The Microstructure Parameters and Microhardness of Controlled Directional Solidified Sn-Ag-Cu Lead Free Solder," TPS-26 International Physics Conference , Turkey, pp.75, 2009
BÖYÜK, U. And MARAŞLI, N. 2009. The Microstructure Parameters and Microhardness of Controlled Directional Solidified Sn-Ag-Cu Lead Free Solder. TPS-26 International Physics Conference , (Turkey), 75.
BÖYÜK, U., & MARAŞLI, N., (2009). The Microstructure Parameters and Microhardness of Controlled Directional Solidified Sn-Ag-Cu Lead Free Solder . TPS-26 International Physics Conference (pp.75). , Turkey
BÖYÜK, UĞUR, And Necmettin MARAŞLI. "The Microstructure Parameters and Microhardness of Controlled Directional Solidified Sn-Ag-Cu Lead Free Solder," TPS-26 International Physics Conference, Turkey, 2009
BÖYÜK, UĞUR And MARAŞLI, Necmettin. "The Microstructure Parameters and Microhardness of Controlled Directional Solidified Sn-Ag-Cu Lead Free Solder." TPS-26 International Physics Conference , Turkey, pp.75, 2009
BÖYÜK, U. And MARAŞLI, N. (2009) . "The Microstructure Parameters and Microhardness of Controlled Directional Solidified Sn-Ag-Cu Lead Free Solder." TPS-26 International Physics Conference , Turkey, p.75.
@conferencepaper{conferencepaper, author={UĞUR BÜYÜK And author={Necmettin MARAŞLI}, title={The Microstructure Parameters and Microhardness of Controlled Directional Solidified Sn-Ag-Cu Lead Free Solder}, congress name={TPS-26 International Physics Conference}, city={}, country={Turkey}, year={2009}, pages={75} }