U. BÜYÜK And N. MARAŞLI, "Dependency of Eutectic Spacings and Microhardness on the Temperature Gradient for Directionally Solidified Sn Ag Cu Lead Free Solder," Materials Chemistry And Physics , vol.119, pp.442-448, 2010
BÜYÜK, U. And MARAŞLI, N. 2010. Dependency of Eutectic Spacings and Microhardness on the Temperature Gradient for Directionally Solidified Sn Ag Cu Lead Free Solder. Materials Chemistry And Physics , vol.119 , 442-448.
BÜYÜK, U., & MARAŞLI, N., (2010). Dependency of Eutectic Spacings and Microhardness on the Temperature Gradient for Directionally Solidified Sn Ag Cu Lead Free Solder. Materials Chemistry And Physics , vol.119, 442-448.
BÜYÜK, UĞUR, And NECMETTİN MARAŞLI. "Dependency of Eutectic Spacings and Microhardness on the Temperature Gradient for Directionally Solidified Sn Ag Cu Lead Free Solder," Materials Chemistry And Physics , vol.119, 442-448, 2010
BÜYÜK, UĞUR And MARAŞLI, NECMETTİN. "Dependency of Eutectic Spacings and Microhardness on the Temperature Gradient for Directionally Solidified Sn Ag Cu Lead Free Solder." Materials Chemistry And Physics , vol.119, pp.442-448, 2010
BÜYÜK, U. And MARAŞLI, N. (2010) . "Dependency of Eutectic Spacings and Microhardness on the Temperature Gradient for Directionally Solidified Sn Ag Cu Lead Free Solder." Materials Chemistry And Physics , vol.119, pp.442-448.
@article{article, author={UĞUR BÜYÜK And author={NECMETTİN MARAŞLI}, title={Dependency of Eutectic Spacings and Microhardness on the Temperature Gradient for Directionally Solidified Sn Ag Cu Lead Free Solder}, journal={Materials Chemistry And Physics}, year=2010, pages={442-448} }